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10-Pack Of 1 Gram Each Syringe! SILVER High Performance CPU Thermal Grease Paste
10-Pack Of 1 Gram Each Syringe! SILVER High Performance CPU Thermal Grease Paste

10-Pack Of 1 Gram Each Syringe! SILVER High Performance CPU Thermal Grease Paste

$ 4.19

Availability: 62 in stock
  • Color: Silver
  • Specific Gravity: 1.35
  • Thermal Conductivity: >3.17W/m-k
  • Metal Oxide Compounds: 60%
  • To Fit: cpu
  • Condition: New
  • Compatible Brand: For Acer, For Alienware, For Apple, For ASUS, For Compaq, For Dell, For eMachines, For GIGABYTE, For HP, For IBM, For Lenovo, For LG, For MSI, For Samsung, For Sony, Universal
  • Thixotropic Index: 350+/-10
  • Silicone Compounds: 20%
  • Power Connection: None
  • Maximum Airflow Volume: All
  • Packaging: Syringe
  • Material: Silver AGO & Silver Powder-High Cooling Material
  • Specifications: 1 Gram In Each Syringe For 10 Grams Total
  • Brand: HALNZIYE
  • Carbon Compounds: 20%
  • UPC: 6971355447106
  • Moment Bore Temperature: -50-280
  • Fan Light Color: Multicolor
  • Type: Thermal Compound
  • Thermal Resistance: <0.067 C-in2/W
  • Maximum Fan Speed: All
  • MPN: 10LOTSLVR1GRM, HY710 SILVER
  • Fan Diameter: All

    Description

    1 Gram In Each Syringe For 10 Grams Total In This Lot
    Silver Cooling High Performance Thermal Grease Compound Paste Syringe.  For CPU GPU VGA LED Heatsink Fan Chipset Chip Heat Spreader.
    Low Thermal Resistance / High Conductivity for heat transfer / High Density
    HY700 series Silver Thermal Grease contains Silver AGO & Silver Powder-High Cooling Performance Material To Improve Thermal Conductivity, Better than Regular Types and Good Partner For CPU / VGA Cooler
    Compliance with RoHS REACH PFOS requirements
    Thermal Conductivity:
    >3.17W/m-k
    Thermal Resistance:
    <0.067 C-in2/W
    Color:
    Silver
    Thermal Conductivity:
    >3.17
    Thermal Impendance:
    <0.067
    Specific Gravity:
    1.35
    Thixotropic Index:
    350+/-10
    Moment Bore Temperature:
    -50-280
    Operation Temperature:
    -30-230
    Ingredients:
    Silicone Compounds:
    20%
    Carbon Compounds:
    20%
    Metal Oxide Compounds:
    60%
    Warning: This is not a Glue!! The sole purpose of this paste is to stay moist and provide additional cooling.
    Warning: If this paste does not provide additional cooling, then there is a problem with either a Circuit Board due to bad capacitors or a short, or is in CPU / GPU Chip due to solder cracking and chip damage because of overheating for significant periods of time.